YINCAE SMT256EP SERIES
One Part/Epoxy Solder/Within function of underfill
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Description
YINCAE SMT256EP Series Application description： Replaces traditional solder paste to provide higher specification reliability.
Additional information
| Brand | YINCAE |
|---|---|
| Application | Die Adhesive |
| Market application | Semiconductor |
| Mix Ratio by Weight | One Part |
| Material | EPOXY |
| Color/Appearance | Silver White |
| Viscosity (mPa.s) | 50,000-100,000 |
| C.T.E. (ppm/℃) | 23.5 |
| Cure Condition | Reflow Process (140℃~260℃) |
| Working Time (@25℃) | 8 hrs |
| Thermal Conductivity (W /mK) | >30 |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
